FR4 Epoxy Laminate:-

This is the standard laminate used in our sector of the industry. We carry stocks of all the main variants. The standard thickness used is 1.8mm, copper thickness is 35 microns

Its closely related to FR5 which is the old high temperature version, but has now been replaced by the more common BT Epoxy type

Product specification

please note: image shown in common pcb in diff sizes. u will recv the material as per item title and des.

COPPER CLAD CIRCUIT BOARD  DOUBLE SIDE

Size / Dimension	6" x 6"
Proto Board Type	Uncoated Copper Clad
Material	Copper Clad FR4, Double Sided, 1 oz.
Board Thickness	0.063" (1.8mm) 1/16"
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant

Test/Specification	FR4 Laminate Typical Values
Thermal Stress, Solder bath 288 deg. C	>60
Dimensional Stability, E-2/150	<0.04% Warp/fill
	<1.00% Bow/Twist
Flammability, Classification UL94	V0
Water Absorption E-1/105	0.10%
Peel Strength After Thermal Stress	11 lb./in After 10s/288 Deg. C
Flexural Strength	100,000 lbf/in² Lengthwise
	75,000 lbf/in² Crosswise
Resistivity After Damp Heat Volume	10 ^8 M ohms cm
Resistivity After Damp Heat Surface	10 ^8 M ohms
Dielectric Breakdown. Parallel to laminate	>60KV
Dielectric Constant @ 1MHz	4.7
Dissipation Factor @ 1MHz	0.014
Q-Resonance @ 1 MHz	>75
Q-Resonance @ 50 MHz	>95
Arc Resistance	125 s
Glass Transition Temperature	135 Deg. C
Temperature Index	130 Deg. C
A Few Other Relevant Facts from other Sources
Specific Gravity	1.8-1.9
Rockwell Hardness (M scale)	110
Coefficient of Thermal Expansion	11 microns/m/Deg.C Lengthwise
	15 microns/m/Deg.C Crosswise
Thermal Conductivity	2.2-2.5 cal/h. cm Deg C

we take care 100% while  packaging the material ;soft packaging n water proof papers sheets but it may be possible a slight damage on corner for few mm after taking all efforts. we will supply a little bigger size copper clad laminate.